Plasma Electronic  
In Deutsch ansehen
  • Start Page
  • Plasma
    • Overview
    • Atomic Layer Deposition
    • Chemical Vapor Deposition
    • Physical Vapor Deposition
    • Adhesion Promotion
    • Oxygen Transmission Rate
  • Application
    • Overview
    • Actiplas
    • ALD 3D
    • Aquacer
    • Carbocer
    • Clearprotect
    • Clearprotect 3D
    • Decocer
    • Lipocer
    • Plasmaclean
  • Devices
    • Overview
    • Domino
    • Domino XV
    • Linea
    • MyPlas
    • PEALD 3D
    • Piccolo
    • Porta
    • PVD Devices
    • Special Devices
  • News
    • Current News
    • Archive
  • Contact
    • Representations
    • Getting There
  • About Us
    • About Us
    • References
    • Disclaimer

ACTIPLAS®

Parts treated with ActiplasParts treated with ACTIPLAS
The ACTIPLAS processes are used to activate different materials chemically. Typical applications are:
  • Activation of plastics for printing and for better wettability
  • Activation of plastics and metals for further application of adhesives
  • Activation to trigger or suppress later certain chemical reactions on the surface
  • Coating with a chemically active polymer layer, for example to enable the insert molding with plastics

The activation of plastics surfaces create chemically reactive groups in the surface. These groups can form a chemical covalent bond to other substances. The result is a perfect adhesion of the substances due to the chemical bond.

It is possible to activate all plastics surfaces like ABS, PC, PE, PP, PA, PEEK and also elastomers. The activation process is specially tailored for the chemical composition of the plastics. Since the activation is performed in vacuum the processes can be controlled very well leading to excellent reproducibility
.

The coating with chemically active plasma polymers results in surfaces that are chemically active for weeks, depending on the storage conditions. This way it is for example possible to mold plastics around metals parts also in longer production chains.

For more information about this topic see the page about
adhesion promotion.

Basic properties
Process temperature20 - 50 °C
Possible substratesplastics, elastomers, metals, ceramics, glass
Possible chemical groupshydroxy, amino, vinyl, silanol, thiol
Contact
Back
© PLASMA ELECTRONIC GmbH                               info@plasma-electronic.de
Otto-Lilienthal-Straße 2, D-79395 Neuenburg, Phone: +49 (0)7631 7017-0, Fax: +49 (0)7631 7017–20
Site Notice/Disclaimer    Privacy                                                       Sitemap